Bungard Profiline Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing

 

raw material cut to size
(Ne-Cut #1)
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CNC-drilling and
contour routing
(BUNGARD CCD/ATC #2)
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brushcleaning
(RBM 402 KF #3)
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galvanic plating
through hole
(COMPACTA 40 2CU #4)
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brushcleaning
(RBM 402 KF #3)
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lamination
of tenting resist
(RLM 419p #5)
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vacuum exposure
(EXP 8000 #6)
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spray developing
(DL 500 D #7)
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spray etching
(DL 500 #8)
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stripping of tenting restist
(DL 500 S #9)
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brushcleaning
(RBM 402 KF #3)
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lamination
of solder mask
(RLM 419p #10)
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exposure of solder mask
(EXP 8000 #6)
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spray developing
(DL 500 D #7)
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curing of solder mask
(EXP 8000 #6)
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CNC-V-cut or contour routing
(Bungard CCD/ATC #2)

System features:

  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer set, artwork production, waste water treatment or surface finishing at any time !
  • Track resolution: better 150µm!
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 1,5 hours!
  • maximales Plattenformat: 300 x 400 mm !
  • maximum throughput: 4,5m² / 8h!
  • maximum usable size: 300 x 400mm!

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