Splash Center


A professional unit that integrates all important steps of PCB wet processing.




  • All bathes covered by lids
  • All bathes can be emptied by front integrated cog-valves
  • Inclusive anti-pollution security tray






Four treatment tanks (from left to right side):

  • Static pre rinse
  • Static plus fresh water spray rinse (including magn. valve and foot-switch)
  • Tank with basket and bath movement by pump, For resist stripping or developing
  • Spare tank, i.e. for electroless tin


Spray etching compartment:

  • Professional spray etching technology
  • 100 µm line definition Etching speed with standard Fe-III-Cl: 35 µm Cu in 90s
  • Max. board size 210 x 300 mm (Splash Center XL 300 x 400mm)
  • Magnetic driven spray pump
  • Built-in 1000 W heater
  • Thermostat controlled
  • Overheat protection
  • Security lid switch
  • Digital timer with count-down, auto-reset and beeper
  • Also suitable for spray developing
  • Special shadow-free PCB holder (titanium)
  • Drop-off position for holder (see picture)


Technical Data:

  • Power supply: 230 V~, 50 Hz approx. 1150 VA
  • Dimensions (L x W x H): 100 x 67 x 121 cm (Splash Center XL 110 x 77 x 120cm)
  • Tank capacity: 1 x 25 l + 3 x 7 l + 1 x 9 l (Splash Center XL 1 x 40 l + 1 x 24 l + 3 x 15 l)
  • Weight: 46kg (Splash Center XL 56kg)


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