Reflow oven HotAir06

  • Outstanding reflow soldering quality for SMD and hybrid
  • Hot air quartz oven Cures SMD adhesive
  • Two heating zones
  • Microprocessor controlled
  • Reflow process view

Technical Data

Power req.:

208/240 V1 phase 50/60 Hz

Rated power:

max. 3650 W

Max. Substrate surface:

300 mm x 370 mm

Number of heating zones:

2, microprocessor controlled

Preheat time:

0-999 sec

Preheat temp:

60-260°C

Reflow Time:

0-999 sec

Reflow temp:

90-300°C

Heat up time to thermal stabilization:

approx. 8 min

Net weight:

18 kg

Options:

connection inert gas N2 with flow meter

All specifications are subject to change without notice.
Bring-in warranty (parts and labour): 12 months

Upon request, we can also supply bigger units and conveyorized units.

Technical Changes Reserved

Manual Hot-Air