Compacta 30 Ni-Au
Compacta 40 Ni-Au
Chemical Nickel-Gold (Sudgold)
Since early 1990s the alloy surface (nickel / phosphorus & gold) is one of the most versatile surfaces. In this method, a nickel layer forms the diffusion barrier between copper and solder alloy. The gold is dissolved in the solder joint and the liability / IMC formation is done with the nickel layer. Electroless nickel-gold requires an upstream copper activation to start the nickel deposition. The nickel layer increases mechanical vias and increases the abrasion resistance.
To apply the chemical Nickel-Gold-alloy we offer a special machine of the Compacta series. This machine has the following features:
Of course a suitable chemical set and necessary accessories can be obtained from us.