ORIGINAL BUNGARD - Bungard Elektronik GmbH & Co.KG

Consumables

Special Purpose Laminates

Besides our standard products we offer some materials for special applications. If you do not find below a suitable product for your application, please contact us.

Anodized Aluminium

for Front Panel Engraving, nature or black. Size approx. 500 x 1000 x 1.5 mm
Technical glass fibre laminate no copper clad, no photoresist. Format: 510 x 1150 x 1.55 mm

Technical glass fibre laminate

no copper clad, no photoresist, size: 510 x 1150
x1.55 mm

Drill backing boards

Drill backing boards for drilling pcbs e.g. with the
BUNGARD CCD.
in stock:

  • 500 x 1000 x 2.5 mm
  • 500 x 1000 x 6 mm
  • 245 x 330 x 6 mm

Teflon

There is an almost endless product variety in high frequency application. That is why we abstain to keep an expensive stock with Teflon products. With pleasure we will coat your material perfectly fitting to your application with our pre-sensitizing service.

Multilayer Consumables

Prepregs (250 x 350 x 0.2 mm)
outer layer (FR4 250 x 350 x 0.3 mm 18/00)
inner layer (FR4 250 x 350 x 0.5 mm 18/18)
separation foil
(packing size for Prepregs and separation foil 50
pcs. each)

Copper clad laminates

FR4, CEM 1, FR2, without photoresist. Approvals and standards as for pre-sensitized boards. The copper surface is not yet brushed. FR 2 is especially suited for isolation milling purposes. Routers and drills will last remarkably longer because of the lack of fibre glass within this product.

These sizes are on stock:

FR4 510 x 1150 mm Copper clad 5 μm double sided thickness 1.5 mm
  Copper clad 18 μm single sided or
double sided
thickness 0.5, 0.8, 1.0 1.5 mm
  Copper clad 35 μm single sided or
double sided
thickness 0.5, 0.8, 1.0 1.5, 2.0, 2.5 mm
  Copper clad 70 μm single sided or
double sided
thickness 0.5, 1.0 1.5, 2.0, 2.5 mm
  Copper clad 105 μm single sided or
double sided
thickness 1.5 mm
FR4 Blue / Black *
* FR4 Black double sided
stock clearance sale
Copper clad 35 μm single sided or
double sided
thickness 1.5 mm
CEM1 Copper clad 35 μm single sided thickness 1.5 mm
FR2 Copper clad 35 μm single sided thickness 1.5 mm

FR4 Thin Laminate

in 0.125 mm and 0.2 mm thickness
For semiflex application and multilayer!

The Bungard semiflex base material combines the advantages of the simple processing of the Bungard standard base material with flexibility for special applications.

Board formats:

  • 100 x 160 mm 35 μm Cu
  • 210 x 300 mm 35 μm Cu
  • 510 x 1150 mm 35 μm Cu

Please note that we sell boards of 100x160 only in units of 35 and 210x300 only in units of 8 boards.

Bohrunterlagen

Unterlagen für das Bohren von Leiterplatten z. B. mit der Bungard CCD sind in folgenden Formaten lieferbar:

  • 500 x 1000 x 2.5 mm
  • 500 x 1000 x 6 mm
  • 245 x 330 x 6 mm

Für die Multilayerherstellung haben wir Prepregs (250 x 350 x 0.2 mm), Decklagen (FR4 250 x 350 x 0.3 mm 18/00), Innenlagen (FR4 250 x 350 x 0.5 mm 18/18) und Trennfolien im Sortiment (Gebindegröße bei Prepregs und Trennfolie je 50 St.)