(Enig = electroless nickel gold)

Chemical Nickel-Gold

Since early 1990s the alloy surface (nickel / phosphorus & gold) is one of the most versatile surfaces. In this method, a nickel layer forms the diffusion barrier between copper and solder alloy. The gold is dissolved in the solder joint and the liability / IMC formation is done with the nickel layer. Electroless nickel-gold requires an upstream copper activation to start the nickel deposition. The nickel layer increases mechanical vias and increases the abrasion resistance.

layer thickness: 3 - 6 μm NiP and 0.05 - 0.12 μm Au

storage time: 12 Months

low / medium / high P systems : (<7; 7-10; >10 % P)

Layer properties

low / medium / high P systems (<7, 7-10;> 10% P)
Layerthickness 3 - 6μm NiP and 0.05-0.12μm Au
Autocatalytic nickel deposition
Gold protects nickel from oxidation
Reliable multi-functional surface
suitable for Al-wire bonding
Growth of the nickel-phosphorus layer of activated copper

Equipment

Compacta 30 chem. Nickel-Gold
This machine can perform nickel and gold plating for printed circuit boards up to a size of 200x300mm. 5 PVC tanks, 2 PP tanks all about 10 liters, 3 Teflon radiators all with thermostatic, 5 Digital Timer, bath movement (adjustable), all tanks with ball valve drain. spray rinse with foot switch, flushing pressure adjustable. Stand-alone machine. Connection: 230 V

Compacta 30