Production of inner layer and multilayer press lamination
raw material cut to size
(Ne-Cut)
CNC-drilling of reference holes of
inner layers
+ prepregs
+ top/bottom layers
(BUNGARD CCD)
brushcleaning of inner layers
(RBM 402KF/RBM 300)
laminating of etch resist
(RLM 419p)
vacuumexposure
(EXP 3040 LED/HELLAS LED)
spray developing
(DL 500/SPLASH)
spray etching
(DL 500/SPLASH CENTER)
stripping of etchresist
(DL 500S/SPLASH CENTER)
brushcleaning
(RBM 402KF/RBM 300)
insert reference pins
(FAVORIT)
mulitlayer press lamination
(RMP 210)
Like Level 3, but in addition: 4, 6, 8, 12 or 24 layers possible. (number of layers in theory possible up to 100 layers)
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29