Surfaces
Comparison
Not every surface is equally suitable for every use.
Surface | Layer / Thickness | Application | Costs | Solderability | Storage |
Sur Tin | 0,8-1,7 μm SN | soldering | ++ | ++ | approx. 6 months |
Ormecon chem tin |
0,08μm org. metal 0,8-1,2μm SN |
soldering, (Conductive Adhesives), press fit technology | ++ | ++ | >12 months |
Chem. Nickel Gold |
3-6μmNiP / 70- 120nm Au |
soldering, AL-wire bonds, Conductive Adhesives | - | ++ | >12 months |
Galv. Gold | 4-6NiP / 0,4- 2μm Au |
Plugs Sanders |
-- | -- | unlimited |
Criteria | chem. Nickel-Gold (ENIG) | chem. Nickel-Thickgold | Hardgold |
Thickness Gold | 0,075-0,3μ | 0,5-max 1,0μ | 1,0-1,2μ |
Thickness Nickel | 4-6μ | 4-6μ | 4-6μ |
Storage | min. 6 months | min. 12 months | min. 12 months |
Application | Alu wire-Bonding | Alu wire- or Gold-wire-bonding | plugs |
Property | soft | soft | hard (Kobalt-alloy) |
costs | medium | medium | high |
Layouthints | none | none | Gold surfaces must be electrically connected |
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