Flow Chart Multilayer complete

Preparation part 1
artwork production

precut films
(Ne-Cut)

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insert film
(Filmstar)

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convert and arrange
Gerberdatas to Bitmap
(PC)

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start photoplotter
(Filmstar)

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develop, fix, rinse and dry film
(dark room)

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control film
(light table)

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cut films to size
(Ne-Cut)

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Film

Preparation part 2
Inner layers

Cut raw material to size
(Ne-Cut)

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CNC-drilling of reference holes
on innerlayers, prepregs +
top/bottom layers
(BUNGARD CCD)

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brushcleaning of inner layers
(RBM 402KF/RBM 300)

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laminating of etch resist
(RLM 419p)

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vacuumexposure
(EXP 3040 LED/HELLAS LED)

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spraydeveloping
(DL500/SPLASH)

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sprayetching
(DL 500/SPLASH CENTER)

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stripping of etchresist
(DL 500S/SPLASH CENTER)

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brushcleaning
(RBM 402KF/RBM 300)

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insert reference pins
(Favorit)

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mulitlayer press lamination
(RMP 210)

PCB standard process
incl. PTH

CNC-drilling
(BUNGARD CCD)

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brushcleaning
(RBM 402KF/RBM 300)

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galvanic PTH
(COMPACTA)

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brushcleaning
(RBM 402KF/RBM 300)

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lamination of etch resist
(RLM 419p)

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vacuum exposure
(EXP 3040 LED/HELLAS LED)

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spray developing
(DL 500/SPLASH)

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spray etching
(DL 500/SPLASH CENTER)

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stripping of etch resist
(DL 500S/SPLASH CENTER)

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brush cleaning
(RBM 402KF/RBM 300)

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chemical tinning
(EG 01/SPLASH CENTER)

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lamination of solder mask
(RLM 419p)

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exposure of solder mask
(EXP 3040 LED/HELLAS LED)

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spray developing
(DL 500/SPLASH)

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curing of soldermask
(EXP 3040 LED/HELLAS LED/hot air oven)

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CNC-V-cut or CNC-routing
(BUNGARD CCD)

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Bungard Elektronik GmbH & Co.KG
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Rilkestrasse 1
D-51570 Windeck

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+49 2292 / 9 28 28 - 29

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