Preparation part 1
artwork production

precut films
(Ne-Cut)

insert film
(Filmstar)

convert and arrange
Gerberdatas to Bitmap
(PC)

start photoplotter
(Filmstar)

develop, fix, rinse and dry film
(dark room)

control film
(light table)

cut films to size
(Ne-Cut)

Film

Preparation part 2
Inner layers

Cut raw material to size
(Ne-Cut)

CNC-drilling of reference holes
on innerlayers, prepregs +
top/bottom layers
(BUNGARD CCD)

brushcleaning of inner layers
(RBM 402KF/RBM 300)

laminating of etch resist
(RLM 419p)

vacuumexposure
(EXP 8000/HELLAS)

spraydeveloping
(DL500/SPLASH)

sprayetching
(DL 500/SPLASH CENTER)

stripping of etchresist
(DL 500S/SPLASH CENTER)

brushcleaning
(RBM 402KF/RBM 300)

insert reference pins
(Favorit)

mulitlayer press lamination
(RMP 210)

PCB standard process
incl. PTH

CNC-drilling
(BUNGARD CCD)

brushcleaning
(RBM 402KF/RBM 300)

galvanic PTH
(COMPACTA)

brushcleaning
(RBM 402KF/RBM 300)

lamination of etch resist
(RLM 419p)

vacuum exposure
(EXP 8000/HELLAS)

spray developing
(DL 500/SPLASH)

spray etching
(DL 500/SPLASH CENTER)

stripping of etch resist
(DL 500S/SPLASH CENTER)

brush cleaning
(RBM 402KF/RBM 300)

chemical tinning
(EG 01/SPLASH CENTER)

lamination of solder mask
(RLM 419p)

exposure of solder mask
(EXP 8000/HELLAS)

spray developing
(DL 500/SPLASH)

curing of soldermask
(EXP 8000/HELLAS/hot air oven)

CNC-V-cut or CNC-routing
(BUNGARD CCD)