nickel-gold plating-surface

Galvanic Nickel-Gold

The nickel-gold plating-surface is abrasion-resistant and corrosion free and therefore it is often used for components with increased mechanical stress (male).
The resist coated circuit board is first provided with an electroplated nickel layer> 3μm as a diffusion barrier (preventing that the subsequent gold gradually "disappears" by diffusion). After the nickel plating followes by the actual galvanic golding. Gold layer between > 0.4μm to 2μm are deposited. This depends of the purpose. For plugs the number of jacking cycles is applied.

0,4 μm: 20 jacking cycles

 

0,7 μm: 50 jacking cycles

 

1,3 μm: 200 jacking cycles

 

2,0 μm: 500 jacking cycles

 

For example

  • 0.4μm 20 jacking cycles
  • 0.7μm, 50 jacking cycles
  • 1.3μm, 200 jacking cycles
  • 2.0μm, 500 jacking cycles
  • With additions such as cobalt etc. (will also "Hard Gold" called) th egold layer can be deposited without a nickel diffusion barrier.

Advantages

  • well suited for higher mechanical stresses.

Storage

  • The shelf life is due to nickel diffusion barrier and the "resilience" of gold "almost" unlimited. Provided, however, is a cleanly executed electroplating.

Disadvantages

  • BlackPad effect possible
  • Cost

Surfaces

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.