PCBs like in Level 2 - in addition with negative resist and galvanic plating through hole
additional in Level 3
raw material cut to size
(Ne-Cut)
CNC-drilling and
contour routing
(BUNGARD CCD/2)
brushcleaning
(RBM 300)
galvanic plating
through hole
(COMPACTA 30)
brushcleaning
(RBM 300)
lamination
of tenting resist
(RLM 419p)
vacuum exposure
(HELLAS LED)
spray developing
(SPLASH D)
spray etching
stripping of tenting resist
(SPLASH CENTER)
brushcleaning
(RBM 300)
chemical tinning
(SPLASH CENTER)
lamination
of solder mask
(RLM 419p)
exposure of solder mask
(HELLAS LED)
spray developing
(SPLASH D)
curing of solder mask
(HELLAS LED or hot air oven)
CNC-V-cut or contour routing
(Bungard CCD/2)
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29