Universally electroplating machine
HitecPlate 2030 + 3040
HitecPlate 2030 and HitecPlate 3040 are universally applicable electroplating machines for the deposition of metals and serve for the production of plated-through-hole printed circuit boards in vertical technology for prototype and small batch production.
The HitecPlate 2030 and HitecPlate 3040 are designed for direct metallization and have baths for process steps cleaning, rinsing, pre-dipping, activating, rinsing, intensifying, rinsing, copper deposition.
Board size: 300x400 (350x450 possible) (3040)
Volumen Treatment tanks: ca. 20 l (3040)
Volumen Galvanic tank: ca. 60 l (3040)
Working height: 900 mm