Universally electroplating machine
HitecPlate 3040 is a universally applicable electroplating machine for the deposition of metals and serve for the production of plated-through-hole printed circuit boards in vertical technology for prototype and small batch production.
The HitecPlate 3040 is designed for direct metallization and have baths for process steps cleaning, rinsing, pre-dipping, activating, rinsing, intensifying, rinsing, copper deposition.
Board size: 300 x 400 mm (350x450 possible)
Volumen Treatment tanks: ca. 20 l
Volumen Galvanic tank: ca. 60 l
Working height: 900 mm