RLM 419p - Trockenresistlaminator - Bungard Elektronik GmbH & Co.KG

Dry Film Laminator

RLM 419 P

The RLM is a dry film laminator especially made for small companies, schools, research and development departments.
All commercial laminates for PCB manufacture and mould-etching technique can be processed.
Due to adjustable pressure control and adjustable laminating speed, solder mask application is also possible without problems.

The machine is also used in very successfully in other application fields like WAFER MASKING and SMT STENCIL production or METAL WORKING.

Lamination width max.: 400 mm

 

Transport width max.: 440 mm

 

Lamination speed: 0,2 - 1,2 m/min

 

Resist tension: adjustable

Features

  • Easy and fast mounting of resist rollers of all common coil diameters
  • Detachable inlet table for easy access to lower resist roll
  • Infinitely adjustable laminating speed
  • Electrically heated lamination rollers with uniform temperature distribution
  • Separate transport rollers for non-creasing laminate transport
  • Digital setting and read out of lamination temperature
  • Manually adjustable lamination pressure
  • For all common dry fi lm resists with 3 and 5 inch core diameter
  • Suitable for solder mask application

Techn. Data

Lamination width max.: 400 mm      
 
Transport width max.: 440 mm    
  
Lamination speed: 0,2-1,2 m/min adjustable

Resist tension: adjustable

Lamination pressure: adjustable

Temperature range: 20 - 120° C digital setting

Power supply: 230 V 50 Hz / 2 kW

Weight: 38 kg        

Dimensions (LxWxH): 690 x 630 x 570 mm

Board thickness: 0.3 – 5 mm

Board size: min 50 x 50mm; max. 450mm x endless

Features
  • Easy and fast mounting of resist rollers of all common coil diameters
  • Detachable inlet table for easy access to lower resist roll
  • Infinitely adjustable laminating speed
  • Electrically heated lamination rollers with uniform temperature distribution
  • Separate transport rollers for non-creasing laminate transport
  • Digital setting and read out of lamination temperature
  • Manually adjustable lamination pressure
  • For all common dry fi lm resists with 3 and 5 inch core diameter
  • Suitable for solder mask application
Technische Data

Lamination width max.: 400 mm      
 
Transport width max.: 440 mm    
  
Lamination speed: 0,2-1,2 m/min adjustable

Resist tension: adjustable

Lamination pressure: adjustable

Temperature range: 20 - 120° C digital setting

Power supply: 230 V 50 Hz / 2 kW

Weight: 38 kg        

Dimensions (LxWxH): 690 x 630 x 570 mm

Board thickness: 0.3 – 5 mm

Board size: min 50 x 50mm; max. 450mm x endless

All specifications are subject to change without notice.