• Maintenance free etching system with solid stream nozzles
• Etching speed of 35 µm Cu within 90 seconds (warm Fe-III-Cl).
• Big window to the etching chamber made from transparent PVC.
• Maximum board size: 210 x 300 mm /Splash-Center XL: 300 x 400
• Line resolution better than 0.1 mm (100 µm)
• Suitable for all common etchants. Fe-III-Cl recommended
• Lid to the etching chamber with safety switch
• Removable board holder made from Titanium and PVC. Can be locked in drip-off position
• Easy access to the etching chamber.
• Strong 1000 W Quarz heater, etching temperature controlled by thermostat
• Overheat fuse
• Digital timer with count down, auto reset and beeper
• Integrated rinsing zone with drip off holder.
• 5 ball valves for all tanks
• Suitable for spray developing

• Magnetic centrifugal pump to revolve developer
• two integrated static rinses, one can be used for neutralization purposes
• Fresh water spray zone activated by foot switch, including splash protection
• A reserve tank, e.g. for immersion tin

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1000 x 670 x 1200 mm

Working Level: 900 mm

Etchingformat: 210 x 300 mm

Tank capacity: 1 x 23 L + 1 x 12 L + 3 x 8 L

Weight: approx. 46 kg

• 5 ball valves to drain all tanks, cover protected from the front side.
• All tanks with lids
• Integrated drip tray for all tanks, sure-footed about 120 mm above the ground
• Integrated mechanical squeeze dryer

Power supply: 220 V~, 50 Hz, approx. 1,5 kW

Dimensions (LxWxH): 1140 x 770 x 1200 mm

Working Level: 900 mm

Etchingformat: 300 x 400 mm

Tank capacity: 1 x 35 L + 1 x 22 L + 3 x 15 L

Weight: approx. 56 kg