Spray etching machine
Splash Center/Splash Center XL
Laboratory etching machine with static and spray rinse, integrated developer tank, a reserve tank for e.g. chemical tinning and a squeeze dryer. The Splash-Center is suitable for double-sided PCBs. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.
A typical workflow for example is to use tank 1 (spray compartment) for etching, tank 2 and 3 for rinsing, tank 4 (with centrifugal pump) for developing and tank 5 for tinning.
Power supply: 230 V~, 50 Hz, approx. 1,5 kW (XL)
Dimensions (LxWxH): 1140 x 770 x 1200 mm (XL)
Etchingformat: 300 x 400 mm (XL)
Tank capacity: 1 x 35 L + 1 x 22 L + 3 x 15 L (XL)