Basisline Level 2

PCBs like in Level 1 - plus green solder mask and blue components printing

additional in Level 2

Image

Original Bungard
positive presensitized boards

Image

CNC-drilling and contour routing
(BUNGARD CCD/2)

Image

vacuum exposure
(HELLAS LED)

Image

dip developing
+ rinsing
+ sprayetching
+ chemical tinning
+ drying
(all in Splash CENTER)

Image

mechanical PTH
(FAVORIT)

Image

lamination
of solder mask

(RLM 419p)

Image

vacuum exposure of solder mask
(HELLAS LED)

Image

spraydeveloping
of solder mask

(SPLASH D)

Image

curing of solder mask
(HELLAS LED or hot air oven)

Image

System features:

Like in Level 1, but in addition:

  • Laminator for laminating solder mask and SPLASH D for developing (2 additional machines)
  • Components printing: repeat Laminating, exposure and developing with blue tenting resist.
  • over all process time: 50 to 120min depending on number of holes
  • maximum throughput: 6m² / 8 h
Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.