The easiest, quickest and cheapest way to protect your pcb is to dip into a Bungard Sur Tin solution. A thin layer of copper will be exchanged with tin. Adhesion and IMC will take place directly on the copper.
Components can be fixed by soldernig or press-fit-connection.
Layer thickness:0,8 – 1,2 μm
Storage time: 12 Months
Solderability: 6 Months