Bungard Sur Tin - Bungard Elektronik GmbH & Co.KG

Chemical Tin

SUR-TIN

The easiest, quickest and cheapest way to protect your pcb is to dip into a Bungard Sur Tin solution. A thin layer of copper will be exchanged with tin. Adhesion and IMC will take place directly on the copper.
Components can be fixed by soldernig or press-fit-connection.

Layer thickness:0,8 – 1,2 μm

 

Storage time: 12 Months

 

Solderability: 6 Months

 

Surface properties

  • Thickness 0,8 – 1,2 µm
  • Suitable for lead free soldering
  • Not suitable for multiple soldering
  • Storage time 12 months, solderability 6 months
  • can be retinned any time
  • Perfect planarity for SMT application
  • Suitable for fine line technology
  • Suitable for compliant pin (press-fit) connection
  • Inexpensive application

Scope of delivery

Sur Tin Part 1, Part 2 und Part 3

Equipment

  • airtight container (can also be used to prepare solution)
  • Tinning bowl Bungard processing dish

Shelf life of prepared solution:
By absence of air: several weeks

Surfaces