Made in Europe - Maschinen | Bungard Elektronik GmbH & Co.KG

Made in Europe

HOTAIR 06 | Bungard Elektronik - Solder oven for SMD component

Reflow Ofen

HotAir 06

The HA06 is a solder oven for SMD component with the use of lead free paste.

The oven is work-ing with full convection forced air during the preheat stage. When the reflow stage is entered the heating will be done by hot air and quartz lamps.

The lamps are needed to get a short ramp speed. Once the refl ow set point is reached the lamp power will be reduced to a minimum. At this point 85% of the heating is caused by forced hot air. This unique feature makes the oven suitable for solder big SMD components and/or components with pads under their casing while using lead free paste.

With good maintenance and proper use the oven will serve your solder needs for a long time with high quality solder results.

Max. substrate surface: 300 x 370 mm

 

Dimensions (LxWxH): 550 x 490 x 335 mm

 

Heating zones: 2 zones - microprocessor controlled

 

Reflow temp: 90 - 300°C

Features

  • Outstanding reflow soldering quality for SMD and hybrid
  • Hot air quartz oven Cures SMD adhesive
  • Two heating zones
  • Microprocessor controlled
  • Reflow process view

Techn. Data

Power req: 208/240 V 1 phase 50/60 Hz

Dimensions (LxWxH): 550 x 490 x 335 mm

Rated power: max. 3650 W

Max. Substrate surfacee: 300 x 370 mm

Number of heating zones: 2 zones - microprocessor controlled

Preheat time: 0 - 999 sec.

Preheat temp: 60 - 260°C

Reflow time: 0 - 999 sec.

Reflow temp: 90 - 300°C

Heat up time to thermal stabilization: approx. 8 min.

Net weight: 18 kg

Options: connection inert gas N2 with flow meter

Features
  • Outstanding reflow soldering quality for SMD and hybrid
  • Hot air quartz oven Cures SMD adhesive
  • Two heating zones
  • Microprocessor controlled
  • Reflow process view
Techn. Data

Power req: 208/240 V 1 phase 50/60 Hz

Dimensions (LxWxH): 550 x 490 x 335 mm

Rated power: max. 3650 W

Max. Substrate surfacee: 300 x 370 mm

Number of heating zones: 2 zones - microprocessor controlled

Preheat time: 0 - 999 sec.

Preheat temp: 60 - 260°C

Reflow time: 0 - 999 sec.

Reflow temp: 90 - 300°C

Heat up time to thermal stabilization: approx. 8 min.

Net weight: 18 kg

Options: connection inert gas N2 with flow meter

SMT Products

All specifications are subject to change without notice.

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

We use cookies

We use cookies on our website. Some of them are essential for the operation of the site, while others help us to improve this site and the user experience (tracking cookies). You can decide for yourself whether you want to allow cookies or not. Please note that if you reject them, you may not be able to use all the functionalities of the site.