PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on throughput
raw material cut to size
(Ne-Cut)
CNC-drilling and
contour routing
(BUNGARD CCD/ATC)
brushcleaning
(RBM 300)
galvanic plating
through hole
(COMPACTA 40 2CU)
brushcleaning
(RBM 300)
lamination
of tenting resist
(RLM 419p #1)
vacuum exposure
(HELLAS)
spray developing
(SPLASH XL)
spray etching
stripping of tenting resist
(SPLASH CENTER XL)
brushcleaning
(RBM 300)
chemical tinning
(SPLASH CENTER XL)
lamination
of solder mask
(RLM 419p #2)
exposure of solder mask
(HELLAS)
spray developing
(SPLASH XL)
curing of solder mask
(HELLAS or hot air oven)
CNC-V-cut or contour routing
(Bungard CCD/ATC)
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29