Made in Germany - Maschinen | Bungard Elektronik GmbH & Co.KG

Made in Germany

now availableVacuum Option

RMP 210 - Multilayerpresse - Bungard Elektronik GmbH & Co.KG

Multilayer press

RMP

This high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs according to industry standards.

HNumber of layers is only limited by the maximum lift of the press plates (38 mm). Using separating metal sheets one can press a couple of boards over each other at the same time.

A compact and floor standing aluminium rack contains all parts of the unit including pressure supply, press plates and heaters.

The large loading door allows quick and easy access to the press chamber and is of course security switch protected.

Board size: brutto: 250 x 350 mm

 

Pressure: > 12 t

 

Temperature: max. up to 250°C

 

Heating up: approx. 30 min.

A compressor, which is integral part of RMP 210 / RMP 3545 is stored in the back of the machine.

In the front, you will find additional storage room for tools or boards (lower door).

The unit is controlled by two digital and adjustable thermostates, one digital timer as well as a pressure valve with pressure meter.

Four strong air ventilators are activated automatically during cooling cycle.

RMP 210

Board size: brutto: 250 x 350 mm, netto: 210 x 300 mm

Pressure: > 12 t

Temperature: up to 250°C free adjustabler (max 290°C as an option)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 180 kg net, approx. 220 kg gross

Power supply: 230 V~, 50-60 Hz, 4000 W 

Dimensions (BxWxH): 650 x 650 x 1390 mm

RMP 3545

Board size: brutto: 350 x 450 mm, netto: 300 x 400 mm

Pressure: > 24 t

Temperature: up to 250°C free adjustabler (max 290°C as an option)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: ca. 430 kg netto, ca. 460 kg brutto

Power supply: 400 V~, 50-60 Hz, 6000 W 

Dimensions (BxWxH): 830x870x1600 mm

RMP

Vacuum Option

Board size: gross 250 x 350 mm, net approx. 210 x 300 mm

Vacuum: approx. -0.7 bar

Temperature: up to 250°C free adjustable

Cooling down: approx. 120 min.

Dimension press plates: approx. 401 x 320,5 mm

Weight: approx. 8 kg press plates, approx. 2 kg vacuum unit

Power supply: 230 V 50-60 Hz 100 W


Features

Steps of multilayer production:

  • Boards are pinned and stack is inserted into press plates.
  • Pressure is created.
  • Heater is activated.
  • Heating up procedure.
  • Press procedure at preset temperature.
  • Cooling down under pressure.
  • PCB stack is taken out of the machine.

The entire sequence will take approx. 3 hours if you start at 20°C and take out the PCBs at a temperature of 30°C. If you take up protective measures, you can remove the boards at higher temperatures and insert a new stack. This way the press cycle reduces to approx. 45 min. Gross size of the PCBs is 250 x 350 mm (or 350 x 450 mm) which corresponds to a PCB net size of 210 x 300 mm (or 300 x400 mm).

To register the layers of your multilayer you can use the register hole function of our software IsoCam and the Bungard Favorit fixes the layers with rivets.

The entire process takes about 3 hours if you start at 20 ° C. In the case of appropriate precautions, the press stack can of course be removed at higher temperatures and the new stack is inserted. In this way, cycles of 45 minutes are possible. The use size of the boards is 210 x 300 mm (300x400) with a raw size of 250 x 350 (350x450) for the Prepregs.

The space between the heating panels is approx. 35 mm. If you use our standard press plates and separate the 1.5mm thick multilayers with 1.5mm press sheets, you can press about 7 multilayers at the same time. Since the press force is generated pneumatically, it is ensured that the pressure is evenly distributed to the area.

For example, you can use the registration hole function of our ISOCAM software to be piled up. It is best to drill the holes with the bungard CCD and pierces with the Bungard FAVORIT

RMP

Steps of multilayer production:

  • Boards are pinned and stack is inserted into press plates.
  • Pressure is created.
  • Heater is activated.
  • Heating up procedure.
  • Press procedure at preset temperature.
  • Cooling down under pressure.
  • PCB stack is taken out of the machine.

The entire sequence will take approx. 3 hours if you start at 20°C and take out the PCBs at a temperature of 30°C. If you take up protective measures, you can remove the boards at higher temperatures and insert a new stack. This way the press cycle reduces to approx. 45 min. Gross size of the PCBs is 250 x 350 mm (or 350 x 450 mm) which corresponds to a PCB net size of 210 x 300 mm (or 300 x400 mm).

To register the layers of your multilayer you can use the register hole function of our software IsoCam and the Bungard Favorit fixes the layers with rivets.

Board size: brutto: 250 x 350 mm, netto: 210 x 300 mm

Pressure: > 12 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 180 kg net, approx. 220 kg gross

Power supply: 230 V , 50-60 Hz, 3500 W 

Dimensions (BxWxH): 650 x 650 x 1390 mm

Board size: brutto: 350 x 450 mm, netto: 300 x 400 mm

Pressure: > 24 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: ca. 430 kg netto, ca. 460 kg brutto

Power supply: 230 V 2 phasis, 50-60 Hz, 6500 W, 32 A plug 

Dimensions (BxWxH): 830x870x1600 mm

All specifications are subject to change without notice.

Bungard Elektronik GmbH & Co.KG
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Rilkestrasse 1
D-51570 Windeck

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+49 2292 / 9 28 28 - 29