RMP 210 - Multilayerpresse - Bungard Elektronik GmbH & Co.KG

Multilayer press

RMP

This high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs according to industry standards.

HNumber of layers is only limited by the maximum lift of the press plates (38 mm). Using separating metal sheets one can press a couple of boards over each other at the same time.

A compact and floor standing aluminium rack contains all parts of the unit including pressure supply, press plates and heaters.

The large loading door allows quick and easy access to the press chamber and is of course security switch protected.

Board size: brutto: 250 x 350 mm

 

Pressure: > 12 t

 

Temperature: max. up to 250°C

 

Heating up: approx. 30 min.

A compressor, which is integral part of RMP 210 / RMP 3545 is stored in the back of the machine.

In the front, you will find additional storage room for tools or boards (lower door).

The unit is controlled by two digital and adjustable thermostates, one digital timer as well as a pressure valve with pressure meter.

Four strong air ventilators are activated automatically during cooling cycle.

RMP 210

Board size: brutto: 250 x 350 mm, netto: 210 x 300 mm

Pressure: > 12 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 130 kg

Power supply: 230 V~, 50 Hz, 16 A 

Dimensions (BxWxH): 650 x 650 x 1390 mm

RMP 3545

Board size: brutto: 350 x 450 mm, netto: 300 x 400 mm

Pressure: > 24 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 260 kg

Power supply: 4000 V~, 50 Hz, 32 A 

Dimensions (BxWxH): 830x870x1600 mm

RMP

Features

Steps of multilayer production:

  • Boards are pinned and stack is inserted into press plates.
  • Pressure is created.
  • Heater is activated.
  • Heating up procedure.
  • Press procedure at preset temperature.
  • Cooling down under pressure.
  • PCB stack is taken out of the machine.

The entire sequence will take approx. 3 hours if you start at 20°C and take out the PCBs at a temperature of 30°C. If you take up protective measures, you can remove the boards at higher temperatures and insert a new stack. This way the press cycle reduces to approx. 45 min. Gross size of the PCBs is 250 x 350 mm (or 350 x 450 mm) which corresponds to a PCB net size of 210 x 300 mm (or 300 x400 mm).

To register the layers of your multilayer you can use the register hole function of our software IsoCam and the Bungard Favorit fixes the layers with rivets.

Der gesamte Vorgang dauert etwa 3 Stunden, wenn Sie bei 20°C starten. Bei entsprechenden Vorsichtsmaßnahmen kann natürlich der Pressstapel bei höheren Temperaturen entnommen und der neue Stapel eingelegt werden. Auf diese Weise sind Zyklen von 45 min. möglich. Die Nutzgröße der Platinen beträgt 210 x 300 mm (300x400) bei einem Rohmaß von 250 x 350 (350x450) für die Prepregs. Der Zwischenraum zwischen den Heizplatten beträgt ca 40 mm. Wenn Sie unsere Standardpressplatten benutzen und die 1,5mm dicken Multilayern mit 1,5mm Pressblechen separieren, dann können Sie etwa 7 Multilayer gleichzeitig verpressen.

Da die Presskraft pneumatisch erzeugt wird, ist sichergestellt, dass der Druck gleichmäßig auf die Fläche verteilt wird.

Zum Verstiften der Prepregstapel können Sie z.B. die Registrierlochfunktion unserer IsoCam-Software benutzen. Die Löcher bohren Sie am besten mit der Bungard CCD und verstiften können Sie mit der Favorit.

RMP
Features

Steps of multilayer production:

  • Boards are pinned and stack is inserted into press plates.
  • Pressure is created.
  • Heater is activated.
  • Heating up procedure.
  • Press procedure at preset temperature.
  • Cooling down under pressure.
  • PCB stack is taken out of the machine.

The entire sequence will take approx. 3 hours if you start at 20°C and take out the PCBs at a temperature of 30°C. If you take up protective measures, you can remove the boards at higher temperatures and insert a new stack. This way the press cycle reduces to approx. 45 min. Gross size of the PCBs is 250 x 350 mm (or 350 x 450 mm) which corresponds to a PCB net size of 210 x 300 mm (or 300 x400 mm).

To register the layers of your multilayer you can use the register hole function of our software IsoCam and the Bungard Favorit fixes the layers with rivets.

RMP 210

Board size: brutto: 250 x 350 mm, netto: 210 x 300 mm

Pressure: > 12 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 130 kg

Power supply: 230 V~, 50 Hz, 16 A 

Dimensions (BxWxH): 650 x 650 x 1390 mm

RMP 3545

Board size: brutto: 350 x 450 mm, netto: 300 x 400 mm

Pressure: > 24 t

Temperature: up to 250°C (adjustable)

Heating up: approx.30 min.

Pressure time: approx. 60 min.

Cooling down: approx. 120 min.

Weight: approx. 260 kg

Power supply: 4000 V~, 50 Hz, 32 A 

Dimensions (BxWxH): 830x870x1600 mm

All specifications are subject to change without notice.