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FR Upgrade Bungard Pick&Place SMT3000 Line 3
Prototypes and small series – Version Eco
Dispensing of solder paste or glue with Print ALL 3000 and Bungard SMD-Stencils
Component Pick&Place with the Bungard SMT 3000 ECO LIGHT Plus (without dispensing function)
Reflow soldering with the Bungard Reflow Ofen HotAir3000
System features:
Max. substrate size: 340 x 170 mm
Max. placement area: 270 x 170 mm
Max. thickness of pcb: 0,5 mm bis ~ 4 mm
Height below pcb: 18mm
Components: Chip 0201 bis QFP 0,65 mm Pitch
Max. component height: ca. 20 mm
Pre-heat temperature: 60-260°C
Reflow time: 0-999 Sekunden
Reflow temperature: 90-300°C
