Upgrade Pick&Place Line 3

Upgrade Bungard Pick&Place SMT3000 Line 3
Prototypes and small series – Version Eco

Dispensing of solder paste or glue with Print ALL 3000 and Bungard SMD-Stencils

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Component Pick&Place with the Bungard SMT 3000 ECO LIGHT Plus (without dispensing function)

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Reflow soldering with the Bungard Reflow Ofen HotAir3000


System features:

Max. substrate size: 340 x 170 mm

Max. placement area: 270 x 170 mm

Max. thickness of pcb: 0,5 mm bis ~ 4 mm

Height below pcb: 18mm

Components: Chip 0201 bis QFP 0,65 mm Pitch

Max. component height: ca. 20 mm

Pre-heat temperature: 60-260°C

Reflow time: 0-999 Sekunden

Reflow temperature: 90-300°C

Bungard Elektronik GmbH & Co.KG
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Rilkestrasse 1
D-51570 Windeck

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+49 2292 / 9 28 28 - 29