Chemical tinning

ORMECON® chemical tin

Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.

Ormecon ® CSN meets all modern requirements for PCBs.

layer thickness: 0,8 – 1,2 μm


storage time : 12 Monate


solderability: 6 Monate



  • completely planar surfaces for SMD technology
  • high storage capacity of bare printed circuit board
  • Energy and cost savings compared to HASL
  • can be used in basket systems without a major investment
  • suitable for horizontal production lines
  • protects the environment
  • simple process control and monitoring
  • all common solder and assembly print varnishes are processed


PROTEC is ideally suited to the Ormecon chemical tinning procedure. The standard machine can process plates up to 200 x 300mm and contains 5 pools for Microetch, combined spray- and static rinse, Organic metal, chemical tinning 7001, hot rinse


  • Deposition of pure tin
  • Up to 50% longer service life of the tin bath
  • significant reduction of the diffusion layer
  • protection against oxidation • mulitiple, including interim storage, possible
  • Rating: 4 hours ageing 155 ° C, 3 x reflow, 1 x Shaft

Additional Options

Plate size 300 x 400mm
Bath movement
Pools for Cleaning Step
Pool for DI rinse

  • Schichtdicke 0,8 – 1,2 μm
  • Geeignet für bleifreies Löten
  • nicht geeignet für Mehrfachlötungen
  • Lagerzeit 12 Monate, Lötfähigkeit 6 Monate
  • kann jederzeit neu verzinnt werden
  • Gute Planarität für SMT-Anwendungen
  • Geeignet für FineLine
  • Geeignet für complinat pin (press-fit) Verbindungen
  • Preisgünstiges Verfahren
SUR-TIN Teil 1, Teil 2 und Teil 3


Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

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