Consumables
Bungard Cotherm®
Base plate: 1 - 2 mm Aluminium
Insulating layer: 0,1 mm (FR4)
ED Copper foil: 0,035 mm
Base plate: 1 - 2 mm Aluminium
Insulating layer: 0,1 mm (FR4)
ED Copper foil: 0,035 mm
COTHERM® is an insulated metal substrate, consisting of three layers: a base plate made of 1000-2000μm aluminum at the bottom and a 35μm thick ED copper foil on the upper side. Between the two layers there is an electrically isolating layer (FR4) in 100μm thickness, consisting of glass fabric combined with a mixture from epoxy resin and ceramic(s). This layer guarantees a very good thermal conduction, a high dielectric strength and a continuous high temperature resistance. The aluminum base plate is provided with a foil that protects the aluminum during the wet processes of the printed circuit board manufacturing process, in order to prevent a contact bridge between the aluminum and copper.
The metal core boards Cotherm® can be supplied with or without a photo layer. The processing is done in the same manner as in Bungard presensitized base material. There is only only difference: The aluminum must be covered when developing or etching the board, in order to prevent contact between the aluminum and the developer or etchant.
COTHERM® is an insulated metal substrate, consisting of three layers: a base plate made of 1000-2000μm aluminum at the bottom and a 35μm thick ED copper foil on the upper side. Between the two layers there is an electrically isolating layer (FR4) in 100μm thickness, consisting of glass fabric combined with a mixture from epoxy resin and ceramic(s). This layer guarantees a very good thermal conduction, a high dielectric strength and a continuous high temperature resistance. The aluminum base plate is provided with a foil that protects the aluminum during the wet processes of the printed circuit board manufacturing process, in order to prevent a contact bridge between the aluminum and copper.
The metal core boards Cotherm® can be supplied with or without a photo layer. The processing is done in the same manner as in Bungard presensitized base material. There is only only difference: The aluminum must be covered when developing or etching the board, in order to prevent contact between the aluminum and the developer or etchant.
All specifications are subject to change without notice.
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29