EN 
DE 
ES 
FR Bungard Profiline Level 3
PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing
raw material cut to size
(Ne-Cut #1)
CNC-drilling and
contour routing
(BUNGARD CCD/ATC #2)
brushcleaning
(RBM 402 KF #3)
galvanic plating
through hole
(COMPACTA 40 2CU #4)
brushcleaning
(RBM 402 KF #3)
lamination
of tenting resist
(RLM 419p #5)
vacuum exposure
(EXP 3040 LED #6)
spray developing
(DL 500 D #7)
spray etching
(DL 500 #8)
stripping of tenting restist
(DL 500 S #9)
brushcleaning
(RBM 402 KF #3)
lamination
of solder mask
(RLM 419p #10)
exposure of solder mask
(EXP 3040 #6)
spray developing
(DL 500 D #7)
curing of solder mask
(EXP 3040 #6)
CNC-V-cut or contour routing
(Bungard CCD/ATC #2)
System features:
- Fine-line technology in industrial quality with green solder mask and blue components printing!
- (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
- Modular upgradeable to multilayer set, artwork production, waste water treatment or surface finishing at any time !
- Track resolution: better 150µm!
- Film production with laser printer or bubble jet or local film supplier.
- Processing time: approx. 1,5 hours!
- maximales Plattenformat: 300 x 400 mm !
- maximum throughput: 4,5m² / 8h!
- maximum usable size: 300 x 400mm!
Rilkestrasse 1
D-51570 Windeck
+49 2292 / 9 28 28 - 29
