Comfortline XL Level 3

PCB production with negative resist, galvanic through hole plating (PTH), green solder mask and blue components printing like Basisline Level 3, but optimized on through put for

board size 300 x 400mm!

 

raw material cut to size
(Ne-Cut)
arrow down2
CNC-drilling and
contour routing
(BUNGARD CCD/ATC)
arrow down2
brushcleaning
(RBM 300)
arrow down2
galvanic plating
through hole
(COMPACTA 40 2CU)
arrow down2
brushcleaning
(RBM 300)
arrow down2
lamination
of tenting resist
(RLM 419p #1)
arrow down2
vacuum exposure
(HELLAS)
arrow down2
spray developing
(SPLASH XL)
arrow down2

spray etching
stripping of tenting resist
(SPLASH CENTER XL)
arrow down2

brushcleaning
(RBM 300)
arrow down2

chemical tinning
(SPLASH CENTER XL)
arrow down2

lamination
of solder mask
(RLM 419p #2)
arrow down2

exposure of solder mask
(HELLAS)
arrow down2
spray developing
(SPLASH XL)
arrow down2
curing of solder mask
(HELLAS or hot air oven)
arrow down2
CNC-V-cut or contour routing
(Bungard CCD/ATC)

System features:

  • CCD/ATC for enhanced drilling, COMPACTA 40 2 CU doubles galvanic throughput, a second laminator RLM 419p avoids changing rolls between the steps!
  • maximum usable size: 300 x 400mm because of COMPACTA 40 2CU, SPLASH XL and SPLASH CENTER XL!
  • Fine-line technology in industrial quality with green solder mask and blue components printing!
  • (To make components printing repeat again from laminating but with RLM 419p #1 and blue tenting resist)
  • Modular upgradeable to multilayer, artwork production, waste water treatment or surface finishing set at any time!
  • Track resolution: better 150µm!
  • Leiterbahnenauflösung: besser als 150μm
  • Film production with laser printer or bubble jet or local film supplier.
  • Processing time: approx. 2 hours
  • maximum throughput: 3,0m² / 8h – approx. three times the volume of Basisline 3!