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RMP Vacuum Option available

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RMP 210 - Multilayerpresse - Bungard Elektronik GmbH & Co.KG

Multilayer press


This high performance multilayer press was designed for PCB labs to enable quick prototyping of multilayer PCBs according to industry standards.

HNumber of layers is only limited by the maximum lift of the press plates (38 mm). Using separating metal sheets one can press a couple of boards over each other at the same time.

A compact and floor standing aluminium rack contains all parts of the unit including pressure supply, press plates and heaters.

The large loading door allows quick and easy access to the press chamber and is of course security switch protected.

Board size: brutto: 250 x 350 mm


Pressure: > 12 t


Temperature: max. up to 250°C


Heating up: approx. 30 min.

A compressor, which is integral part of RMP 210 / RMP 3545 is stored in the back of the machine.

In the front, you will find additional storage room for tools or boards (lower door).

The unit is controlled by two digital and adjustable thermostates, one digital timer as well as a pressure valve with pressure meter.

Four strong air ventilators are activated automatically during cooling cycle.

Bungard Elektronik GmbH & Co.KG

Rilkestrasse 1
D-51570 Windeck

+49 2292 / 9 28 28 - 29

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