EN 
DE 
ES 
FR Preparation part 1
artwork production
precut films
(Ne-Cut)
insert film
(Filmstar)
convert and arrange
Gerberdatas to Bitmap
(PC)
start photoplotter
(Filmstar)
develop, fix, rinse and dry film
(dark room)
control film
(light table)
cut films to size
(Ne-Cut)
Film
Preparation part 2
Inner layers
Cut raw material to size
(Ne-Cut)
CNC-drilling of reference holes
on innerlayers, prepregs +
top/bottom layers
(BUNGARD CCD)
brushcleaning of inner layers
(RBM 402KF/RBM 300)
laminating of etch resist
(RLM 419p)
vacuumexposure
(EXP 3040 LED/HELLAS LED)
spraydeveloping
(DL500/SPLASH)
sprayetching
(DL 500/SPLASH CENTER)
stripping of etchresist
(DL 500S/SPLASH CENTER)
brushcleaning
(RBM 402KF/RBM 300)
insert reference pins
(Favorit)
mulitlayer press lamination
(RMP 210)
PCB standard process
incl. PTH
CNC-drilling
(BUNGARD CCD)
brushcleaning
(RBM 402KF/RBM 300)
galvanic PTH
(COMPACTA)
brushcleaning
(RBM 402KF/RBM 300)
lamination of etch resist
(RLM 419p)
vacuum exposure
(EXP 3040 LED/HELLAS LED)
spray developing
(DL 500/SPLASH)
spray etching
(DL 500/SPLASH CENTER)
stripping of etch resist
(DL 500S/SPLASH CENTER)
brush cleaning
(RBM 402KF/RBM 300)
chemical tinning
(EG 01/SPLASH CENTER)
lamination of solder mask
(RLM 419p)
exposure of solder mask
(EXP 3040 LED/HELLAS LED)
spray developing
(DL 500/SPLASH)
curing of soldermask
(EXP 3040 LED/HELLAS LED/hot air oven)
CNC-V-cut or CNC-routing
(BUNGARD CCD)
