The SprintDryer can be connected in any way to any type of sprint, with a suitable dryer available for each throughput width of the Sprint series. Of course, you can also use the SprintDryer together with the DL500 or as a stand-alone-unit with or without an underframe and with or without an inlet or outlet table.
Ormecon immersion tin is a method for chemical tin plating of copper surfaces.
The special on Ormecon process is a 0.08 micron thick layer of organic metal, which optimally prepares the surface for subsequent tinning and then prevents the 'diffusion of copper through the tin.
Ormecon ® CSN meets all modern requirements for PCBs.
The resist coated circuit board is first provided with an electroplated nickel layer> 3μm as a diffusion barrier (preventing that the subsequent gold gradually "disappears" by diffusion). After the nickel plating followes by the actual galvanic golding. Gold layer between > 0.4μm to 2μm are deposited. This depends of the purpose. For plugs the number of jacking cycles is applied.